SOLDER PREFORM PDF
SOLDER PREFORM MANUAL

Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.) Filing date Publication date Priority claimed from JP2005-268209 external-priority Priority claimed from PCT/JP2006/318248 external-priority patent/WO2007032429A1/en Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd Priority to US12/923,319 priority Critical patent/US10081852B2/en Publication of US20110068149A1 publication Critical patent/US20110068149A1/en Assigned to DENSO CORPORATION, SENJU METAL INDUSTRY CO., LTD. Original Assignee Senju Metal Industry Co Ltd Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.) ( en Inventor Naohiko Hirano Akira Tanahashi Yoshitsugu Sakamoto Kaichi Tsuruta Takashi Ishii Satoshi Soga Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.) Granted Application number US12/923,319 Other versions US10081852B2

SOLDER PREFORM PDF

Google Patents Solder preform and a process for its manufactureĭownload PDF Info Publication number US20110068149A1 US20110068149A1 US12/923,319 US92331910A US2011068149A1 US 20110068149 A1 US20110068149 A1 US 20110068149A1 US 92331910 A US92331910 A US 92331910A US 2011068149 A1 US2011068149 A1 US 2011068149A1 Authority US United States Prior art keywords solder metal particles flux preform melting point Prior art date Legal status (The legal status is an assumption and is not a legal conclusion. Google Patents US20110068149A1 - Solder preform and a process for its manufacture solder_fortification_preforms_98552_a4_r7.US20110068149A1 - Solder preform and a process for its manufacture.Improved shape and volume of fillet to ensure joints meet IPC specifications

SOLDER PREFORM MANUAL

Reduced rework and other manual processes to add solder volume Stronger solder joints, which help improve drop test results Increased solder volume compared to what could be achieved with just solder pasteĮlimination of costly or time-consuming processes, such as wave soldering or selective soldering The preform increases the volume of solder above what could be achieved with just solder paste, especially for stencils with a pitch of 0.3mm or less. Since the alloy for both the preform and the solder paste are the same, the preform will reflow at the same temperature as the solder paste, with the solder paste providing the necessary flux. The preform is added to a deposit of solder paste using standard pick and place equipment. Solder Fortification® Preforms are generally rectangle- or disc-shaped pieces of alloyed metal that do not contain any flux. Solder Fortification® Preforms can provide the solution for these challenging issues. However, miniaturization trends, such as the reduction of stencil thickness and more tightly fitted components, make this increasingly difficult. Obtaining the correct amount of solder to ensure a strong solder joint is critical in electronics manufacturing.